Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging.
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| Title: | Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging. |
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| Authors: | Peng, Jian1, pengjian365@126.com, Fu, Liming1, Sun, Yanle1, Li, Ziyong1, Ji, Xinbo1, Shan, Aidang1, adshan@sjtu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; 2020, Vol. 31 Issue 21, p19366-19380, 15p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-020-04470-9 |
