APA (7th ed.) Citation

Peng, J., Fu, L., Sun, Y., Li, Z., Ji, X., & Shan, A. (2020). Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging. Journal of Materials Science: Materials in Electronics, 31(21), 19366. https://doi.org/10.1007/s10854-020-04470-9

Chicago Style (17th ed.) Citation

Peng, Jian, Liming Fu, Yanle Sun, Ziyong Li, Xinbo Ji, and Aidang Shan. "Thermal Expansion-adjustable Carbon-doped FeCoCrNiMn High-entropy Alloys for Electronic Packaging." Journal of Materials Science: Materials in Electronics 31, no. 21 (2020): 19366. https://doi.org/10.1007/s10854-020-04470-9.

MLA (9th ed.) Citation

Peng, Jian, et al. "Thermal Expansion-adjustable Carbon-doped FeCoCrNiMn High-entropy Alloys for Electronic Packaging." Journal of Materials Science: Materials in Electronics, vol. 31, no. 21, 2020, p. 19366, https://doi.org/10.1007/s10854-020-04470-9.