Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging.
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| Title: | Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging. |
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| Authors: | Peng, Jian1, pengjian365@126.com, Fu, Liming1, Sun, Yanle1, Li, Ziyong1, Ji, Xinbo1, Shan, Aidang1, adshan@sjtu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; 2020, Vol. 31 Issue 21, p19366-19380, 15p |
| Database: | Applied Science & Technology Source |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 147299457 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Peng%2C+Jian%22">Peng, Jian</searchLink><relatesTo>1</relatesTo>, <i>pengjian365@126.com</i><br /><searchLink fieldCode="AU" term="%22Fu%2C+Liming%22">Fu, Liming</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Sun%2C+Yanle%22">Sun, Yanle</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Ziyong%22">Li, Ziyong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ji%2C+Xinbo%22">Ji, Xinbo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shan%2C+Aidang%22">Shan, Aidang</searchLink><relatesTo>1</relatesTo>, <i>adshan@sjtu.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; 2020, Vol. 31 Issue 21, p19366-19380, 15p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=147299457 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-020-04470-9 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 19366 Titles: – TitleFull: Thermal expansion-adjustable carbon-doped FeCoCrNiMn high-entropy alloys for electronic packaging. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Peng, Jian – PersonEntity: Name: NameFull: Fu, Liming – PersonEntity: Name: NameFull: Sun, Yanle – PersonEntity: Name: NameFull: Li, Ziyong – PersonEntity: Name: NameFull: Ji, Xinbo – PersonEntity: Name: NameFull: Shan, Aidang IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 11 Text: 2020 Type: published Y: 2020 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 31 – Type: issue Value: 21 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
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