Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys.

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Bibliographic Details
Title: Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys.
Authors: Straumal, Boris1,2,3,4, straumal@issp.ac.ru, Kogtenkova, Olga2, Bulatov, Marat5, Nekrasov, Alexei6, Baranchikov, Alexandr7, Baretzky, Brigitte1, Straumal, Alexandr2,4
Source: Journal of Materials Science; 2021, Vol. 56 Issue 13, p7840-7848, 9p, 1 Black and White Photograph, 4 Graphs
Database: Applied Science & Technology Source
Description
ISSN:00222461
DOI:10.1007/s10853-020-05674-4