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Thermomigration behavior of Sn–Bi joints under different substrate.

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Bibliographic Details
Title: Thermomigration behavior of Sn–Bi joints under different substrate.
Authors: Wu, Jun1, Wang, Kaipeng1, Wang, Fengjiang1, fjwang@just.edu.cn, Liao, Mingqing1, mingqing_liao@just.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2022, Vol. 33 Issue 10, p8127-8139, 13p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-022-07962-y