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Thermomigration behavior of Sn–Bi joints under different substrate.

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Title: Thermomigration behavior of Sn–Bi joints under different substrate.
Authors: Wu, Jun1, Wang, Kaipeng1, Wang, Fengjiang1, fjwang@just.edu.cn, Liao, Mingqing1, mingqing_liao@just.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2022, Vol. 33 Issue 10, p8127-8139, 13p
Database: Applied Science & Technology Source
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An: 156108471
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  Data: Thermomigration behavior of Sn–Bi joints under different substrate.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2022, Vol. 33 Issue 10, p8127-8139, 13p
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-022-07962-y
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      – Code: eng
        Text: English
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        PageCount: 13
        StartPage: 8127
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      – TitleFull: Thermomigration behavior of Sn–Bi joints under different substrate.
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            NameFull: Wu, Jun
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            NameFull: Wang, Kaipeng
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            NameFull: Wang, Fengjiang
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            NameFull: Liao, Mingqing
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            – D: 01
              M: 04
              Text: Apr2022
              Type: published
              Y: 2022
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              Value: 33
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              Value: 10
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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