Thermomigration behavior of Sn–Bi joints under different substrate.
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| Title: | Thermomigration behavior of Sn–Bi joints under different substrate. |
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| Authors: | Wu, Jun1, Wang, Kaipeng1, Wang, Fengjiang1, fjwang@just.edu.cn, Liao, Mingqing1, mingqing_liao@just.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Apr2022, Vol. 33 Issue 10, p8127-8139, 13p |
| Database: | Applied Science & Technology Source |
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