Diffusion Bonding of Al7075 to Ti-6Al-4V by Spark Plasma Sintering and Using a Copper Interlayer.

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Bibliographic Details
Title: Diffusion Bonding of Al7075 to Ti-6Al-4V by Spark Plasma Sintering and Using a Copper Interlayer.
Authors: Alhazaa, Abdulaziz1,2, aalhazaa@ksu.edu.sa, Albrithen, Hamad1,2, Hezam, Mahmoud2,3, Ali Shar, Muhammad2, Alhwaimel, Ibrahim1, Alharbi, Yasser2, Estournes, Claude4, aalhazaa@ksu.edu.sa
Source: Crystals (2073-4352); Sep2022, Vol. 12 Issue 9, pN.PAG-N.PAG, 9p
Database: Applied Science & Technology Source
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ISSN:20734352
DOI:10.3390/cryst12091293