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51‐3: Copper Thin Film Dry Etching Equipment via ECR Plasma Source.

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Bibliographic Details
Title: 51‐3: Copper Thin Film Dry Etching Equipment via ECR Plasma Source.
Authors: Jang, Jin Nyoung1, Lee, Jong Hwa1, Jung, Jae Hoon1, Jung, Kiro1, Lee, Sangheon2, Kim, Donghoon2, Hong, Mun‐Pyo2, Kim, Sang‐Gab3, Jang, Soo Ouk4, Kim, Chiwoo5
Source: SID Symposium Digest of Technical Papers; Jun2023, Vol. 54 Issue 1, p734-737, 4p
Database: Applied Science & Technology Source
Description
ISSN:0097966X
DOI:10.1002/sdtp.16665