Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form.
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| Title: | Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form. |
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| Authors: | Tanaka, Yasunori1, y.tanaka24@kurenai.waseda.jp, Koshiba, Keiko1, Iizuka, Tomonori1, Ito, Mayumi2, Higashimine, Koichi2, Tatsumi, Kohei1 |
| Source: | Welding International; Nov2023, Vol. 37 Issue 11, p666-675, 10p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09507116 |
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| DOI: | 10.1080/09507116.2023.2230657 |
