APA (7th ed.) Citation

Tanaka, Y., Koshiba, K., Iizuka, T., Ito, M., Higashimine, K., & Tatsumi, K. (2023). Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form. Welding International, 37(11), 666. https://doi.org/10.1080/09507116.2023.2230657

Chicago Style (17th ed.) Citation

Tanaka, Yasunori, Keiko Koshiba, Tomonori Iizuka, Mayumi Ito, Koichi Higashimine, and Kohei Tatsumi. "Direct Bonding of Ni Nanoparticles to a Semiconductor Al Electrode in Air and Its Form." Welding International 37, no. 11 (2023): 666. https://doi.org/10.1080/09507116.2023.2230657.

MLA (9th ed.) Citation

Tanaka, Yasunori, et al. "Direct Bonding of Ni Nanoparticles to a Semiconductor Al Electrode in Air and Its Form." Welding International, vol. 37, no. 11, 2023, p. 666, https://doi.org/10.1080/09507116.2023.2230657.