Individual Effects of Various Plasma-Related Factors on the High Aspect Ratio Oxide Etching Process at Low-Frequency Bias Power Using an Inductively Coupled Plasma System.
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| Title: | Individual Effects of Various Plasma-Related Factors on the High Aspect Ratio Oxide Etching Process at Low-Frequency Bias Power Using an Inductively Coupled Plasma System. |
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| Authors: | Son, Hye Jun1, Efremov, Alexander2, Choi, Gilyoung1, Kwon, Kwang-Ho1, kwonkh@korea.ac.kr |
| Source: | Plasma Chemistry & Plasma Processing; Jan2024, Vol. 44 Issue 1, p635-649, 15p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 02724324 |
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| DOI: | 10.1007/s11090-023-10363-6 |
