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Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

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Bibliographic Details
Title: Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
Authors: Lee, Jing Rou1, Chong, Mun Xi1, Abdul Aziz, Mohd Sharizal1, msharizal@usm.my, Khor, Chu Yee2, Mohd Salleh, Mohd Arif Anuar3, Mohd Arif Zainol, Mohd Remy Rozainy4, Ani, F. Che5
Source: Journal of Electronic Materials; Mar2024, Vol. 53 Issue 3, p1169-1182, 14p
Database: Applied Science & Technology Source
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ISSN:03615235
DOI:10.1007/s11664-023-10782-3