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Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

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Title: Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
Authors: Lee, Jing Rou1, Chong, Mun Xi1, Abdul Aziz, Mohd Sharizal1, msharizal@usm.my, Khor, Chu Yee2, Mohd Salleh, Mohd Arif Anuar3, Mohd Arif Zainol, Mohd Remy Rozainy4, Ani, F. Che5
Source: Journal of Electronic Materials; Mar2024, Vol. 53 Issue 3, p1169-1182, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 175199731
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=175199731
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-023-10782-3
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 1169
    Titles:
      – TitleFull: Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
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            NameFull: Lee, Jing Rou
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            NameFull: Chong, Mun Xi
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            NameFull: Abdul Aziz, Mohd Sharizal
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            NameFull: Khor, Chu Yee
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            NameFull: Mohd Salleh, Mohd Arif Anuar
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            NameFull: Mohd Arif Zainol, Mohd Remy Rozainy
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            – D: 01
              M: 03
              Text: Mar2024
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              Y: 2024
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            – TitleFull: Journal of Electronic Materials
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