Transient liquid-phase infiltration bonding of copper using porous copper interlayer.
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| Title: | Transient liquid-phase infiltration bonding of copper using porous copper interlayer. |
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| Authors: | Miyajima, Ryo1, Yagane, Ryota1, Matsushima, Michiya1, Fukumoto, Shinji1, fukumoto@mapse.eng.osaka-u.ac.jp |
| Source: | Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 5, p1-14, 14p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-024-12116-3 |
