APA (7th ed.) Citation

Miyajima, R., Yagane, R., Matsushima, M., & Fukumoto, S. (2024). Transient liquid-phase infiltration bonding of copper using porous copper interlayer. Journal of Materials Science: Materials in Electronics, 35(5), 1. https://doi.org/10.1007/s10854-024-12116-3

Chicago Style (17th ed.) Citation

Miyajima, Ryo, Ryota Yagane, Michiya Matsushima, and Shinji Fukumoto. "Transient Liquid-phase Infiltration Bonding of Copper Using Porous Copper Interlayer." Journal of Materials Science: Materials in Electronics 35, no. 5 (2024): 1. https://doi.org/10.1007/s10854-024-12116-3.

MLA (9th ed.) Citation

Miyajima, Ryo, et al. "Transient Liquid-phase Infiltration Bonding of Copper Using Porous Copper Interlayer." Journal of Materials Science: Materials in Electronics, vol. 35, no. 5, 2024, p. 1, https://doi.org/10.1007/s10854-024-12116-3.