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Transient liquid-phase infiltration bonding of copper using porous copper interlayer.

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Title: Transient liquid-phase infiltration bonding of copper using porous copper interlayer.
Authors: Miyajima, Ryo1, Yagane, Ryota1, Matsushima, Michiya1, Fukumoto, Shinji1, fukumoto@mapse.eng.osaka-u.ac.jp
Source: Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 5, p1-14, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 175510971
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Transient liquid-phase infiltration bonding of copper using porous copper interlayer.
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  Data: <searchLink fieldCode="AU" term="%22Miyajima%2C+Ryo%22">Miyajima, Ryo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yagane%2C+Ryota%22">Yagane, Ryota</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Matsushima%2C+Michiya%22">Matsushima, Michiya</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fukumoto%2C+Shinji%22">Fukumoto, Shinji</searchLink><relatesTo>1</relatesTo>, <i>fukumoto@mapse.eng.osaka-u.ac.jp</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Feb2024, Vol. 35 Issue 5, p1-14, 14p
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-12116-3
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 1
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      – TitleFull: Transient liquid-phase infiltration bonding of copper using porous copper interlayer.
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            NameFull: Miyajima, Ryo
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            NameFull: Yagane, Ryota
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            NameFull: Matsushima, Michiya
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            NameFull: Fukumoto, Shinji
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              M: 02
              Text: Feb2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 5
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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