Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.
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| Title: | Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor. |
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| Authors: | Tian, Xu1, Ding, Yuancan1, Chai, Gaoda2, chaigaoda@huawei.com, Tang, Yupu1, Lei, Renbo1, Jia, Guodong2, Zhang, Yuanju1, Li, Jinxiong1, Zhou, Yi1, Wang, Xinwei1,3, wangxw@pkusz.edu.cn |
| Source: | Advanced Materials Technologies; Feb2024, Vol. 9 Issue 4, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 2365709X |
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| DOI: | 10.1002/admt.202301541 |
