APA (7th ed.) Citation

Tian, X., Ding, Y., Chai, G., Tang, Y., Lei, R., Jia, G., . . . Wang, X. (2024). Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor. Advanced Materials Technologies, 9(4), 1. https://doi.org/10.1002/admt.202301541

Chicago Style (17th ed.) Citation

Tian, Xu, et al. "Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor." Advanced Materials Technologies 9, no. 4 (2024): 1. https://doi.org/10.1002/admt.202301541.

MLA (9th ed.) Citation

Tian, Xu, et al. "Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor." Advanced Materials Technologies, vol. 9, no. 4, 2024, p. 1, https://doi.org/10.1002/admt.202301541.