View in EDS

Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.

Saved in:
Bibliographic Details
Title: Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.
Authors: Tian, Xu1, Ding, Yuancan1, Chai, Gaoda2, chaigaoda@huawei.com, Tang, Yupu1, Lei, Renbo1, Jia, Guodong2, Zhang, Yuanju1, Li, Jinxiong1, Zhou, Yi1, Wang, Xinwei1,3, wangxw@pkusz.edu.cn
Source: Advanced Materials Technologies; Feb2024, Vol. 9 Issue 4, p1-9, 9p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 175548433
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Tian%2C+Xu%22">Tian, Xu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Yuancan%22">Ding, Yuancan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chai%2C+Gaoda%22">Chai, Gaoda</searchLink><relatesTo>2</relatesTo>, <i>chaigaoda@huawei.com</i><br /><searchLink fieldCode="AU" term="%22Tang%2C+Yupu%22">Tang, Yupu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lei%2C+Renbo%22">Lei, Renbo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Jia%2C+Guodong%22">Jia, Guodong</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yuanju%22">Zhang, Yuanju</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Jinxiong%22">Li, Jinxiong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Yi%22">Zhou, Yi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Xinwei%22">Wang, Xinwei</searchLink><relatesTo>1,3</relatesTo>, <i>wangxw@pkusz.edu.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Advanced+Materials+Technologies%22">Advanced Materials Technologies</searchLink>; Feb2024, Vol. 9 Issue 4, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=175548433
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1002/admt.202301541
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 1
    Titles:
      – TitleFull: Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Tian, Xu
      – PersonEntity:
          Name:
            NameFull: Ding, Yuancan
      – PersonEntity:
          Name:
            NameFull: Chai, Gaoda
      – PersonEntity:
          Name:
            NameFull: Tang, Yupu
      – PersonEntity:
          Name:
            NameFull: Lei, Renbo
      – PersonEntity:
          Name:
            NameFull: Jia, Guodong
      – PersonEntity:
          Name:
            NameFull: Zhang, Yuanju
      – PersonEntity:
          Name:
            NameFull: Li, Jinxiong
      – PersonEntity:
          Name:
            NameFull: Zhou, Yi
      – PersonEntity:
          Name:
            NameFull: Wang, Xinwei
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 19
              M: 02
              Text: Feb2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 2365709X
          Numbering:
            – Type: volume
              Value: 9
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Advanced Materials Technologies
              Type: main
ResultId 1