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Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.

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Bibliographic Details
Title: Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.
Authors: liu, Yulei1,2, Qi, Haichao2, Liu, Changfeng2, Li, Chao2, Zhao, Xinke3, Hou, Jingbin2, Li, Liangbin1, lbli@ustc.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 6, p1-9, 9p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-024-11985-y