APA (7th ed.) Citation

liu, Y., Qi, H., Liu, C., Li, C., Zhao, X., Hou, J., & Li, L. (2024). Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion. Journal of Materials Science: Materials in Electronics, 35(6), 1. https://doi.org/10.1007/s10854-024-11985-y

Chicago Style (17th ed.) Citation

liu, Yulei, Haichao Qi, Changfeng Liu, Chao Li, Xinke Zhao, Jingbin Hou, and Liangbin Li. "Rationally Design of Substrate Surface Topography Toward the Improvement of Cu-plated Coating Adhesion." Journal of Materials Science: Materials in Electronics 35, no. 6 (2024): 1. https://doi.org/10.1007/s10854-024-11985-y.

MLA (9th ed.) Citation

liu, Yulei, et al. "Rationally Design of Substrate Surface Topography Toward the Improvement of Cu-plated Coating Adhesion." Journal of Materials Science: Materials in Electronics, vol. 35, no. 6, 2024, p. 1, https://doi.org/10.1007/s10854-024-11985-y.