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Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.

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Title: Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.
Authors: liu, Yulei1,2, Qi, Haichao2, Liu, Changfeng2, Li, Chao2, Zhao, Xinke3, Hou, Jingbin2, Li, Liangbin1, lbli@ustc.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 6, p1-9, 9p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
An: 175659666
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PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.
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  Data: <searchLink fieldCode="AU" term="%22liu%2C+Yulei%22">liu, Yulei</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Qi%2C+Haichao%22">Qi, Haichao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Changfeng%22">Liu, Changfeng</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Chao%22">Li, Chao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Xinke%22">Zhao, Xinke</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Hou%2C+Jingbin%22">Hou, Jingbin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Liangbin%22">Li, Liangbin</searchLink><relatesTo>1</relatesTo>, <i>lbli@ustc.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Feb2024, Vol. 35 Issue 6, p1-9, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=175659666
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-024-11985-y
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      – Code: eng
        Text: English
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        PageCount: 9
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      – TitleFull: Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.
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      – PersonEntity:
          Name:
            NameFull: liu, Yulei
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            NameFull: Qi, Haichao
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            NameFull: Liu, Changfeng
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            NameFull: Li, Chao
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            NameFull: Zhao, Xinke
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            NameFull: Hou, Jingbin
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            NameFull: Li, Liangbin
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            – D: 21
              M: 02
              Text: Feb2024
              Type: published
              Y: 2024
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              Value: 35
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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