Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion.
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| Title: | Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion. |
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| Authors: | liu, Yulei1,2, Qi, Haichao2, Liu, Changfeng2, Li, Chao2, Zhao, Xinke3, Hou, Jingbin2, Li, Liangbin1, lbli@ustc.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Feb2024, Vol. 35 Issue 6, p1-9, 9p |
| Database: | Applied Science & Technology Source |
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