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Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.

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Bibliographic Details
Title: Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.
Authors: Cui, Ze1, Jia, Qiang1, Wang, Yishu1, Li, Dan1, Wang, Chien-Ping2, Zhang, Hongqiang3, Lu, Ziyi1, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng4, Guo, Fu1,5, guofu@bjut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 11, p1-13, 13p
Database: Applied Science & Technology Source
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ISSN:09574522
DOI:10.1007/s10854-024-12492-w