APA (7th ed.) Citation

Cui, Z., Jia, Q., Wang, Y., Li, D., Wang, C., Zhang, H., . . . Guo, F. (2024). Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles. Journal of Materials Science: Materials in Electronics, 35(11), 1. https://doi.org/10.1007/s10854-024-12492-w

Chicago Style (17th ed.) Citation

Cui, Ze, et al. "Enhanced Shear Strength and Microstructure of Cu–Cu Interconnection by Low-temperature Sintering of Cu Nanoparticles." Journal of Materials Science: Materials in Electronics 35, no. 11 (2024): 1. https://doi.org/10.1007/s10854-024-12492-w.

MLA (9th ed.) Citation

Cui, Ze, et al. "Enhanced Shear Strength and Microstructure of Cu–Cu Interconnection by Low-temperature Sintering of Cu Nanoparticles." Journal of Materials Science: Materials in Electronics, vol. 35, no. 11, 2024, p. 1, https://doi.org/10.1007/s10854-024-12492-w.