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Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.

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Title: Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.
Authors: Cui, Ze1, Jia, Qiang1, Wang, Yishu1, Li, Dan1, Wang, Chien-Ping2, Zhang, Hongqiang3, Lu, Ziyi1, Ma, Limin1, malimin@bjut.edu.cn, Zou, Guisheng4, Guo, Fu1,5, guofu@bjut.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 11, p1-13, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 176915139
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PubTypeId: academicJournal
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  Data: Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.
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  Data: <searchLink fieldCode="AU" term="%22Cui%2C+Ze%22">Cui, Ze</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Jia%2C+Qiang%22">Jia, Qiang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Yishu%22">Wang, Yishu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Dan%22">Li, Dan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Chien-Ping%22">Wang, Chien-Ping</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Hongqiang%22">Zhang, Hongqiang</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lu%2C+Ziyi%22">Lu, Ziyi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ma%2C+Limin%22">Ma, Limin</searchLink><relatesTo>1</relatesTo>, <i>malimin@bjut.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Zou%2C+Guisheng%22">Zou, Guisheng</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Fu%22">Guo, Fu</searchLink><relatesTo>1,5</relatesTo>, <i>guofu@bjut.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2024, Vol. 35 Issue 11, p1-13, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=176915139
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        Value: 10.1007/s10854-024-12492-w
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        Text: English
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        PageCount: 13
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      – TitleFull: Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.
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              Text: Apr2024
              Type: published
              Y: 2024
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              Value: 35
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              Value: 11
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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