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Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

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Bibliographic Details
Title:	Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
Authors:	Ma, Limin¹, Lu, Ziyi¹, Jia, Qiang¹, jiaqiang@bjut.edu.cn, Cui, Ze¹, Wang, Yishu¹, Li, Dan¹, Zhang, Hongqiang², Zou, Guisheng³, Guo, Fu^1,4, guofu@bjut.edu.cn
Source:	Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p2988-2998, 11p
Database:	Applied Science & Technology Source
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Description
ISSN:	03615235
DOI:	10.1007/s11664-024-11021-z