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Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

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Title: Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
Authors: Ma, Limin1, Lu, Ziyi1, Jia, Qiang1, jiaqiang@bjut.edu.cn, Cui, Ze1, Wang, Yishu1, Li, Dan1, Zhang, Hongqiang2, Zou, Guisheng3, Guo, Fu1,4, guofu@bjut.edu.cn
Source: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p2988-2998, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 178046869
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Jun2024, Vol. 53 Issue 6, p2988-2998, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=178046869
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      – Type: doi
        Value: 10.1007/s11664-024-11021-z
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 11
        StartPage: 2988
    Titles:
      – TitleFull: Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
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            NameFull: Ma, Limin
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            NameFull: Zhang, Hongqiang
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            – D: 01
              M: 06
              Text: Jun2024
              Type: published
              Y: 2024
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              Value: 53
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              Value: 6
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            – TitleFull: Journal of Electronic Materials
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