Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices.
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| Title: | Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices. |
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| Authors: | Raghav, Khushbu1,2, Kaur, Maninder1, Upadhyay, Anand1, Kumar, Amit1,2, Bansal, Deepak1,2, deepak@ceeri.res.in |
| Source: | Journal of Electronic Materials; Aug2024, Vol. 53 Issue 8, p4529-4538, 10p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-024-11184-9 |