APA (7th ed.) Citation

Raghav, K., Kaur, M., Upadhyay, A., Kumar, A., & Bansal, D. (2024). Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices. Journal of Electronic Materials, 53(8), 4529. https://doi.org/10.1007/s11664-024-11184-9

Chicago Style (17th ed.) Citation

Raghav, Khushbu, Maninder Kaur, Anand Upadhyay, Amit Kumar, and Deepak Bansal. "Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices." Journal of Electronic Materials 53, no. 8 (2024): 4529. https://doi.org/10.1007/s11664-024-11184-9.

MLA (9th ed.) Citation

Raghav, Khushbu, et al. "Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices." Journal of Electronic Materials, vol. 53, no. 8, 2024, p. 4529, https://doi.org/10.1007/s11664-024-11184-9.