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Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices.

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Title: Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices.
Authors: Raghav, Khushbu1,2, Kaur, Maninder1, Upadhyay, Anand1, Kumar, Amit1,2, Bansal, Deepak1,2, deepak@ceeri.res.in
Source: Journal of Electronic Materials; Aug2024, Vol. 53 Issue 8, p4529-4538, 10p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices.
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        Value: 10.1007/s11664-024-11184-9
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 4529
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      – TitleFull: Comparative Study of DC, Unipolar and Bipolar Pulsed Electroplating Profile of Thick Gold Structures for MEMS Devices.
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            NameFull: Raghav, Khushbu
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            NameFull: Kaur, Maninder
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            NameFull: Upadhyay, Anand
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            NameFull: Kumar, Amit
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            – D: 01
              M: 08
              Text: Aug2024
              Type: published
              Y: 2024
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              Value: 53
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