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Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.

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Bibliographic Details
Title: Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.
Authors: Lin, Bo-Yi1, Lin, Ting-Chun2, Kao, Chin-Li2, Hsiao, Shih-Chieh1, Tseng, Pei-Hsuan1, Kuo, Jui-Chao1, jckuo@mail.ncku.edu.tw
Source: Journal of Electronic Materials; Oct2024, Vol. 53 Issue 10, p6471-6481, 11p
Database: Applied Science & Technology Source
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Description
ISSN:03615235
DOI:10.1007/s11664-024-11360-x