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Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

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Bibliographic Details
Title:	Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.
Authors:	Zhao, Yuwen¹, Yang, Jiyou¹, Xu, Liming¹, Zhao, Yueqi¹, Li, Kun¹, Yang, Linmei¹, lmyang10b@alum.imr.ac.cn
Source:	Journal of Electronic Materials; Mar2025, Vol. 54 Issue 3, p2308-2314, 7p
Database:	Applied Science & Technology Source
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Description
ISSN:	03615235
DOI:	10.1007/s11664-024-11621-9