APA (7th ed.) Citation

Zhao, Y., Yang, J., Xu, L., Zhao, Y., Li, K., & Yang, L. (2025). Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints. Journal of Electronic Materials, 54(3), 2308. https://doi.org/10.1007/s11664-024-11621-9

Chicago Style (17th ed.) Citation

Zhao, Yuwen, Jiyou Yang, Liming Xu, Yueqi Zhao, Kun Li, and Linmei Yang. "Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints." Journal of Electronic Materials 54, no. 3 (2025): 2308. https://doi.org/10.1007/s11664-024-11621-9.

MLA (9th ed.) Citation

Zhao, Yuwen, et al. "Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints." Journal of Electronic Materials, vol. 54, no. 3, 2025, p. 2308, https://doi.org/10.1007/s11664-024-11621-9.