Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.
Saved in:
| Title: | Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li. |
|---|---|
| Authors: | Liu, X.1, Zhou, T. H.1, Kong, L. W.1, Li, Y. W.1, Xing, Z. B.1, Pang, L.1, Wu, W. B.1, Ma, K. Y.1, Li, P.1, pengli@ysu.edu.cn |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); May2025, Vol. 77 Issue 5, p3482-3492, 11p |
| Database: | Applied Science & Technology Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
| ISSN: | 10474838 |
|---|---|
| DOI: | 10.1007/s11837-025-07202-8 |
