APA (7th ed.) Citation

Liu, X., Zhou, T. H., Kong, L. W., Li, Y. W., Xing, Z. B., Pang, L., . . . Li, P. (2025). Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 77(5), 3482. https://doi.org/10.1007/s11837-025-07202-8

Chicago Style (17th ed.) Citation

Liu, X., T. H. Zhou, L. W. Kong, Y. W. Li, Z. B. Xing, L. Pang, W. B. Wu, K. Y. Ma, and P. Li. "Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 77, no. 5 (2025): 3482. https://doi.org/10.1007/s11837-025-07202-8.

MLA (9th ed.) Citation

Liu, X., et al. "Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 77, no. 5, 2025, p. 3482, https://doi.org/10.1007/s11837-025-07202-8.