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Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.

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Title: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.
Authors: Liu, X.1, Zhou, T. H.1, Kong, L. W.1, Li, Y. W.1, Xing, Z. B.1, Pang, L.1, Wu, W. B.1, Ma, K. Y.1, Li, P.1, pengli@ysu.edu.cn
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); May2025, Vol. 77 Issue 5, p3482-3492, 11p
Database: Applied Science & Technology Source
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  Data: <searchLink fieldCode="JN" term="%22JOM%3A+The+Journal+of+The+Minerals%2C+Metals+%26+Materials+Society+%28TMS%29%22">JOM: The Journal of The Minerals, Metals & Materials Society (TMS)</searchLink>; May2025, Vol. 77 Issue 5, p3482-3492, 11p
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        Value: 10.1007/s11837-025-07202-8
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        Text: English
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      – TitleFull: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.
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            – D: 01
              M: 05
              Text: May2025
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              Y: 2025
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