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A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad.

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Title: A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad.
Authors: Hsu, Chung-Kai1, Hung, Fei-Yi1, fyhung@mail.ncku.edu.tw, Wu, Bo-Ding1
Source: Journal of Electronic Materials; Jul2025, Vol. 54 Issue 7, p5848-5882, 35p
Database: Applied Science & Technology Source
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ISSN:03615235
DOI:10.1007/s11664-025-11998-1