APA (7th ed.) Citation

Hsu, C., Hung, F., & Wu, B. (2025). A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad. Journal of Electronic Materials, 54(7), 5848. https://doi.org/10.1007/s11664-025-11998-1

Chicago Style (17th ed.) Citation

Hsu, Chung-Kai, Fei-Yi Hung, and Bo-Ding Wu. "A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad." Journal of Electronic Materials 54, no. 7 (2025): 5848. https://doi.org/10.1007/s11664-025-11998-1.

MLA (9th ed.) Citation

Hsu, Chung-Kai, et al. "A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad." Journal of Electronic Materials, vol. 54, no. 7, 2025, p. 5848, https://doi.org/10.1007/s11664-025-11998-1.