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Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition.

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Bibliographic Details
Title:	Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition.
Authors:	Ning, Jianping^1,2, Niu, Chunjie², Tang, Zhen^1,2, Sun, Yue², Yan, Hao², Zhou, Dayu¹, zhoudayu@dlut.edu.cn
Source:	Coatings (2079-6412); Jun2025, Vol. 15 Issue 6, p708, 16p
Database:	Applied Science & Technology Source
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ISSN:	20796412
DOI:	10.3390/coatings15060708