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Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition.

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Title: Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition.
Authors: Ning, Jianping1,2, Niu, Chunjie2, Tang, Zhen1,2, Sun, Yue2, Yan, Hao2, Zhou, Dayu1, zhoudayu@dlut.edu.cn
Source: Coatings (2079-6412); Jun2025, Vol. 15 Issue 6, p708, 16p
Database: Applied Science & Technology Source
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      – Type: doi
        Value: 10.3390/coatings15060708
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      – Code: eng
        Text: English
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        PageCount: 16
        StartPage: 708
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      – TitleFull: Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition.
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            NameFull: Tang, Zhen
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            – D: 01
              M: 06
              Text: Jun2025
              Type: published
              Y: 2025
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              Value: 15
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