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The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits.

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Bibliographic Details
Title: The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits.
Authors: Chan, Yi-Cheng1, Liao, Ming-Han1,2, Yao, Chun-Wei1,2, cyao@lamar.edu
Source: Applied Sciences (2076-3417); Sep2025, Vol. 15 Issue 17, p9847, 13p
Database: Applied Science & Technology Source
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ISSN:20763417
DOI:10.3390/app15179847