Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration.
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| Title: | Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration. |
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| Authors: | Sayed, Biju Theruvil1, Alkhazaleh, Hamzah Ali2, halkhazaleh@ud.ac.ae, Rodrigues, Paul3, Askar, Shavan4,5, Sharma, M. K.6, Almufti, Saman M.5,7 |
| Source: | Nondestructive Testing & Evaluation; Dec2025, Vol. 40 Issue 12, p6086-6106, 21p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 10589759 |
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| DOI: | 10.1080/10589759.2025.2455451 |
