APA (7th ed.) Citation

Sayed, B. T., Alkhazaleh, H. A., Rodrigues, P., Askar, S., Sharma, M. K., & Almufti, S. M. (2025). Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration. Nondestructive Testing & Evaluation, 40(12), 6086. https://doi.org/10.1080/10589759.2025.2455451

Chicago Style (17th ed.) Citation

Sayed, Biju Theruvil, Hamzah Ali Alkhazaleh, Paul Rodrigues, Shavan Askar, M. K. Sharma, and Saman M. Almufti. "Optimising Solder Joint Inspection in Printed Circuit Boards Through X-ray Imaging and Machine Learning Integration." Nondestructive Testing & Evaluation 40, no. 12 (2025): 6086. https://doi.org/10.1080/10589759.2025.2455451.

MLA (9th ed.) Citation

Sayed, Biju Theruvil, et al. "Optimising Solder Joint Inspection in Printed Circuit Boards Through X-ray Imaging and Machine Learning Integration." Nondestructive Testing & Evaluation, vol. 40, no. 12, 2025, p. 6086, https://doi.org/10.1080/10589759.2025.2455451.