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Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration.

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Title: Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration.
Authors: Sayed, Biju Theruvil1, Alkhazaleh, Hamzah Ali2, halkhazaleh@ud.ac.ae, Rodrigues, Paul3, Askar, Shavan4,5, Sharma, M. K.6, Almufti, Saman M.5,7
Source: Nondestructive Testing & Evaluation; Dec2025, Vol. 40 Issue 12, p6086-6106, 21p
Database: Applied Science & Technology Source
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  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 189506953
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Sayed%2C+Biju+Theruvil%22">Sayed, Biju Theruvil</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Alkhazaleh%2C+Hamzah+Ali%22">Alkhazaleh, Hamzah Ali</searchLink><relatesTo>2</relatesTo>, <i>halkhazaleh@ud.ac.ae</i><br /><searchLink fieldCode="AU" term="%22Rodrigues%2C+Paul%22">Rodrigues, Paul</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Askar%2C+Shavan%22">Askar, Shavan</searchLink><relatesTo>4,5</relatesTo><br /><searchLink fieldCode="AU" term="%22Sharma%2C+M%2E+K%2E%22">Sharma, M. K.</searchLink><relatesTo>6</relatesTo><br /><searchLink fieldCode="AU" term="%22Almufti%2C+Saman+M%2E%22">Almufti, Saman M.</searchLink><relatesTo>5,7</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Nondestructive+Testing+%26+Evaluation%22">Nondestructive Testing & Evaluation</searchLink>; Dec2025, Vol. 40 Issue 12, p6086-6106, 21p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=189506953
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1080/10589759.2025.2455451
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 21
        StartPage: 6086
    Titles:
      – TitleFull: Optimising solder joint inspection in printed circuit boards through X-ray imaging and machine learning integration.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Sayed, Biju Theruvil
      – PersonEntity:
          Name:
            NameFull: Alkhazaleh, Hamzah Ali
      – PersonEntity:
          Name:
            NameFull: Rodrigues, Paul
      – PersonEntity:
          Name:
            NameFull: Askar, Shavan
      – PersonEntity:
          Name:
            NameFull: Sharma, M. K.
      – PersonEntity:
          Name:
            NameFull: Almufti, Saman M.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 10589759
          Numbering:
            – Type: volume
              Value: 40
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Nondestructive Testing & Evaluation
              Type: main
ResultId 1