An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings.
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| Title: | An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings. |
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| Authors: | An, Ning1,2, Li, Bofeng1,2, Wang, Yuexing1,2, wangyuexing_mtrc@caep.cn, Sun, Xiangyu1,2, He, Xu3, hexu@njust.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Jan2026, Vol. 37 Issue 3, p1-12, 12p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-026-16591-8 |
