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An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings.

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Title: An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings.
Authors: An, Ning1,2, Li, Bofeng1,2, Wang, Yuexing1,2, wangyuexing_mtrc@caep.cn, Sun, Xiangyu1,2, He, Xu3, hexu@njust.edu.cn
Source: Journal of Materials Science: Materials in Electronics; Jan2026, Vol. 37 Issue 3, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 190980067
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Label: Title
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  Data: An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings.
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  Label: Authors
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  Data: <searchLink fieldCode="AU" term="%22An%2C+Ning%22">An, Ning</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Bofeng%22">Li, Bofeng</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Yuexing%22">Wang, Yuexing</searchLink><relatesTo>1,2</relatesTo>, <i>wangyuexing_mtrc@caep.cn</i><br /><searchLink fieldCode="AU" term="%22Sun%2C+Xiangyu%22">Sun, Xiangyu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Xu%22">He, Xu</searchLink><relatesTo>3</relatesTo>, <i>hexu@njust.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jan2026, Vol. 37 Issue 3, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=190980067
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-026-16591-8
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings.
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            NameFull: An, Ning
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            NameFull: Li, Bofeng
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            NameFull: Wang, Yuexing
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            NameFull: Sun, Xiangyu
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            NameFull: He, Xu
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            – D: 21
              M: 01
              Text: Jan2026
              Type: published
              Y: 2026
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              Value: 09574522
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              Value: 37
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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