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Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.

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Bibliographic Details
Title: Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.
Authors: Saadouni, I.1, ibrahim.saadouni@etu.uae.ac.ma, El Mrimar, O.1, Samoudi, B.1
Source: Journal of Applied Fluid Mechanics; Jun2026, Vol. 19 Issue 6, p1349-1364, 16p
Database: Applied Science & Technology Source
Description
ISSN:17353572
DOI:10.47176/jafm.19.6.4133