Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.
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| Title: | Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices. |
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| Authors: | Saadouni, I.1, ibrahim.saadouni@etu.uae.ac.ma, El Mrimar, O.1, Samoudi, B.1 |
| Source: | Journal of Applied Fluid Mechanics; Jun2026, Vol. 19 Issue 6, p1349-1364, 16p |
| Database: | Applied Science & Technology Source |
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